High heat accumulation in WAAM have a negative effect on the stability of the process in terms of the geometrical accuracy, deposition defects, microstructural evolution and material properties of as-fabricated parts. A common way of preventing heat accumulation is to implement interlayer cooling times before depositing the subsequent layer. However, the idle times required to cool down the interlayer temperature during printing of large scale components can be significantly high which is against the higher deposition rate nature of the WAAM process.

Metal Worm suggests a brand-new active cooling system that promotes heat transmission to the substrate and thus reduce high heat accumulation. Additionally, active cooling technology makes it possible to produce parts on thinner substrates, which reduces substrate waste and costs.

The WAAM process can be accelerated using active cooling technology by cutting down on the inter-layer cooling time.

MetalWorm’s studies has revealed that the presence of cooling table in WAAM process slightly decreases the grain size and has nearly no effect on the phase distribution.